Preparation and characterization of calcium copper titanate filled epoxy composites for embedded capacitor applications

Mohd Saidina, Dandan Satia (2015) Preparation and characterization of calcium copper titanate filled epoxy composites for embedded capacitor applications. Masters thesis, Universiti Sains Malaysia.

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Abstract

Permintaan yang semakin meningkat untuk pengecilan peranti elektronik menawarkan pengurangan saiz yang ketara, prestasi dielektrik dan haba yang lebih baik, kebolehpercayaan dan kos yang lebih rendah. Komposit polimer-seramik telah dipilih sebagai bahan dielektrik yang paling sesuai untuk kapasitor terbenam. Dalam kajian ini, seramik seperti kalsium kuprum titanat, CaCu3Ti4O12 (CCTO) dan barium titanat (BaTiO3) telah digunakan sebagai pengisi dalam komposit epoksi filem nipis. Sifat-sifat komposit epoksi filem nipis dihasilkan berdasarkan muatan pengisi yang berbeza (5 hingga 20% isipadu), kaedah fabrikasi seperti salutan putaran (SC) dan tekan panas (HP), pengisi hibrid (CCTO dan BaTiO3), rawatan permukaan pengisi dan pelbagai jenis resin epoksi (DER 332, Epolam 2015 dan OP 392) telah dikaji. Keputusan menunjukkan bahawa komposit CCTO/epoksi mempamerkan pemalar dielektrik, Tg dan kekonduksian haba yang lebih tinggi berbanding dengan epoksi tidak terisi dan komposit BaTiO3/epoksi. Dalam siri kedua, pengisi CCTO untuk pengisian komposit epoksi telah dipilih untuk siasatan lanjutan. Komposit CCTO/epoksi dengan pengisian sehingga 40% isipadu dapat dihasilkan dengan menggunakan kaedah HP. Hasil ujian telah menunjukkan bahawa sifat-sifat komposit 40% isipadu CCTO/epoksi (HP) telah meningkat sebanyak 55% pemalar dielektrik dan 83% modulus simpanan, dan penurunan 69% pekali pengembangan haba berbanding dengan sifat-sifat komposit 20% isipadu CCTO/epoksi (SC). Pengisi Hibrid untuk pengisian komposit epoksi telah dihasilkan dan keputusan menunjukkan bahawa Hibrid 70:30 mempamerkan kesan hibrid yang positif berbanding dengan komposit pengisi tunggal; komposit filem nipis CCTO/epoksi dan BaTiO3/epoksi. Continuous miniaturization of electronic devices result in a high demand of embedded capacitor that offers significant reduction in size, better dielectric and thermal performance, reliability and lower cost. Polymer-ceramic composites have been considered as the most suitable dielectric materials for embedded capacitor. In this study, ceramics such as calcium copper titanate, CaCu3Ti4O12 (CCTO) and barium titanate (BaTiO3) were used as fillers in epoxy thin film composites. The properties of epoxy thin film composites fabricated based on different filler loading (5 to 20 vol%), fabrication methods such as spin coating (SC) and hot press (HP) methods, hybrid fillers (CCTO and BaTiO3), surface treatment of filler and various types of epoxy resins (DER 332, Epolam 2015 and OP 392) were characterized. Results showed that CCTO/epoxy composite exhibited higher dielectric constant, Tg and thermal conductivity compared to those of unfilled epoxy and BaTiO3/epoxy composites. In the second series, CCTO filler filled epoxy composite was chosen for further investigation. CCTO/epoxy composite with filler loading of up to 40 vol% was able to be produced by using HP method. It was found that 40 vol% CCTO/epoxy (HP) composite has increased 55% of dielectric constant and 83% of storage modulus, and decreased 69% of CTE compared to 20 vol% CCTO/epoxy (SC) composite. Hybrid fillers composites were fabricated and results indicated that Hybrid 70:30 showed positive hybrid effect compared to those of single filler composites; CCTO/epoxy and BaTiO3/epoxy thin film composites.

Item Type: Thesis (Masters)
Additional Information: Full text is available at irplus.eng.usm.my
Subjects: T Technology > TN Mining Engineering. Metallurgy
T Technology > TP Chemical Technology > TP1-1185 Chemical technology
Divisions: Kampus Kejuruteraan (Engineering Campus) > Pusat Pengajian Kejuruteraan Bahan & Sumber Mineral (School of Material & Mineral Resource Engineering) > Thesis
Depositing User: Badli Syahar Bakhtier_PKejut
Date Deposited: 01 Mar 2018 08:58
Last Modified: 12 Apr 2019 05:25
URI: http://eprints.usm.my/id/eprint/39203

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