Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization

Mayappan, Ramani (2007) Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization. PhD thesis, USM.

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Abstract

Secara praktiknya kesemua pemasangan elektronik masa kini menggunakan pateri eutektik Sn-Pb pada antara penyambung. Practically all microelectronic assemblies in use today utilize Sn-Pb eutectic solder for interconnection.

Item Type: Thesis (PhD)
Subjects: Q Science
Divisions: Pusat Pengajian Sains Fizik (School of Physics) > Thesis
Depositing User: Mr Firdaus Mohamad
Date Deposited: 04 Sep 2015 08:23
Last Modified: 22 Mar 2017 02:23
URI: http://eprints.usm.my/id/eprint/29392

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