Hor, Bing Yao (2022) Effect Of Agitation To Electroless Nickel Plating Of NiP/Ag Nanocomposite. Project Report. Universiti Sains Malaysia, Pusat Pengajian Kejuruteraan Bahan dan Sumber Mineral. (Submitted)
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Abstract
Electroless nickel (EN) plating is an attractive metallization technique for electronic components due to its properties such as uniform coating thickness, lower surface roughness and good thermal stability. Nanocomposites have provided multifunctionality and additional strengthening effects in the nickel-phosphorus (Ni-P) matrix. However, agglomeration of nanoparticles in the plating solution has become a main challenge in EN composite plating. In this study, 30 mg/L of 10 nm silver nanoparticles (AgNPs) was added into EN plating solution to produce nickel-phosphorus-silver (NiP/Ag) nanocomposite under the assistant of magnetic stirring at different stirring rate (0, 100, 200, 300, 400, and 500 rpm) with target to improve electrical contact of NiP surface and wettability of solder reflow. Various characterization methods were used to characterize NiP/Ag nanocomposite such as X-ray diffraction (XRD), atomic force microscopy (AFM), scanning electron microscopy (SEM), Ossila contact angle goniometer and contact resistance test. In XRD analysis, NiP/Ag nanocomposite has sharper peak compared to NiP coating and 500 rpm of NiP/Ag has the sharpest peak at plane (111). Next, the results showed that the suitable magnetic stirring rate for NiP/Ag coatings in terms of thickness and wettability is at 100 rpm which give the thickest coating of 9.46 μm and lowest contact angle of 22.84o. However, 0 rpm is a suitable magnetic stirring rate to produce the lowest surface roughness of NiP/Ag nanocomposite with Ra 23.22 nm and lowest resistivity of 0.1133 Ω-cm.
| Item Type: | Monograph (Project Report) |
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| Subjects: | T Technology T Technology > TN Mining Engineering. Metallurgy |
| Divisions: | Kampus Kejuruteraan (Engineering Campus) > Pusat Pengajian Kejuruteraan Bahan & Sumber Mineral (School of Material & Mineral Resource Engineering) > Monograph |
| Depositing User: | Mr Engku Shahidil Engku Ab Rahman |
| Date Deposited: | 27 Jan 2023 08:57 |
| Last Modified: | 27 Jan 2023 08:57 |
| URI: | http://eprints.usm.my/id/eprint/56585 |
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