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Items where Author is "Chong, Jia Jun"
Group by: Item Type | No Grouping Jump to: Monograph Number of items: 1. MonographChong, Jia Jun (2019) Influence Of Copper Pillar Bump Structure On Flip Chip Packaging During Reflow Soldering. Project Report. Universiti Sains Malaysia, Pusat Pengajian Kejuruteraan Mekanik. (Submitted) |
