| |||||||||
| |||||||||
Items where Author is "Chong, Jia Jun"
Group by: Item Type | No Grouping Number of items: 1. Chong, Jia Jun (2019) Influence Of Copper Pillar Bump Structure On Flip Chip Packaging During Reflow Soldering. Project Report. Universiti Sains Malaysia, Pusat Pengajian Kejuruteraan Mekanik. (Submitted) |
