Items where Author is "Chek, Muhammad Asyraf Wan"

Up a level
Export as [feed] Atom [feed] RSS 1.0 [feed] RSS 2.0
Group by: Item Type | No Grouping
Jump to: Monograph
Number of items: 1.

Monograph

Chek, Muhammad Asyraf Wan (2019) Structural And Reliability Analysis Of Solder Joint Under Vibration Loading. Project Report. Universiti Sains Malaysia, Pusat Pengajian Kejuruteraan Mekanik. (Submitted)

This list was generated on Fri Nov 22 02:29:18 2024 +08.
USM Repository is powered by EPrints 3 which is developed by the School of Electronics and Computer Science at the University of Southampton. More information and software credits.
Share