Items where Author is "Chek, Muhammad Asyraf Wan"

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Chek, Muhammad Asyraf Wan (2019) Structural And Reliability Analysis Of Solder Joint Under Vibration Loading. Project Report. Universiti Sains Malaysia, Pusat Pengajian Kejuruteraan Mekanik. (Submitted)

This list was generated on Fri Nov 22 02:29:18 2024 +08.

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