Silver Spot Plating Technique.

Siah, C.H. and Aziz, N. and Samad, Z and Idris, M. N. and Miskam, M.A. (2005) Silver Spot Plating Technique. In: Proceedings of the 4" Mechanical Engineering Research Colloquium (MERC 200511), 27-29 January 2005, School of Mechanical Engineering, USM, Penang, Malaysia.

Preview

PDF Download (4MB) | Preview

Abstract

Electroplating play an important roles in semiconductor manufacturing industries. A layer of silver or gold was selectively plated on the surface of lead frame by using electroplating technology. The purpose of depositing a layer of gold or silver on the surface of lead frame is to improve the bondability during die attach and wire bonding process.

Item Type:	Conference or Workshop Item (Paper)
Subjects:	T Technology > TP Chemical Technology > TP1-1185 Chemical technology
Divisions:	Kampus Kejuruteraan (Engineering Campus) > Pusat Pengajian Kejuruteraan Kimia (School of Chemical Engineering)
Depositing User:	ARKM Al Rashid Automasi
Date Deposited:	07 May 2009 03:36
Last Modified:	13 Jul 2013 04:14
URI:	http://eprints.usm.my/id/eprint/9773

Actions (login required)

View Item