Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization [TK7870. R165 2007 f rb].

Mayappan, Ramani (2007) Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization [TK7870. R165 2007 f rb]. PhD thesis, Universiti Sains Malaysia.

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Abstract

Secara praktiknya kesemua pemasangan elektronik masa kini menggunakan pateri eutektik Sn-Pb pada antara penyambung. Akibat pertambahan penggunaan peranti elektronik dalam industri serta untuk kegunaan peribadi, maka penggunaan pateri penyambung juga bertambah. Practically all microelectronic assemblies in use today utilize Sn-Pb eutectic solder for interconnection. Due to the increase in the use of electronic devices within the industry as well as personal use, the usage of solder connections has increased.

Item Type: Thesis (PhD)
Subjects: T Technology > TK Electrical Engineering. Electronics. Nuclear Engineering > TK7800-8360 Electronics
Divisions: Kampus Kejuruteraan (Engineering Campus) > Pusat Pengajian Kejuruteraan Bahan & Sumber Mineral (School of Material & Mineral Resource Engineering) > Thesis
Depositing User: Mr Erwan Roslan
Date Deposited: 23 Apr 2009 06:51
Last Modified: 15 May 2017 08:05
URI: http://eprints.usm.my/id/eprint/9486

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