Heat Pipes In Electronic Packaging [TJ264. S774 2007 f rb].

Munusamy, Sri Jaiandran (2006) Heat Pipes In Electronic Packaging [TJ264. S774 2007 f rb]. Masters thesis, Universiti Sains Malaysia.

Preview

PDF Download (188kB) | Preview

Abstract

Industri electronik berkembang ke arah qualiti dan kelajuan computational yang tinggi. Keadaan ini menyebabkan peningkatan dalam flux haba. Sehubungan itu, para jurutera menghadapi satu cabaran baru untuk menangani masalah dalam pembungkusan chip. The electronic industry is developing towards higher quality and computational speed. It has led to the increase in chip heat fluxes. Therefore, the challenge has come for the engineers to overcome the problem in chip packaging.

Item Type:	Thesis (Masters)
Subjects:	T Technology > TJ Mechanical engineering and machinery > TJ255-265 Heat engines
Divisions:	Kampus Kejuruteraan (Engineering Campus) > Pusat Pengajian Kejuruteraan Mekanikal (School of Mechanical Engineering) > Thesis
Depositing User:	Mr Erwan Roslan
Date Deposited:	13 Apr 2009 03:26
Last Modified:	17 Apr 2017 09:26
URI:	http://eprints.usm.my/id/eprint/9052

Actions (login required)

View Item