Methodologies For Thermal Analysis In Single Die And Stacked Dies Electronic Packaging

Law, Ruen Ching (2012) Methodologies For Thermal Analysis In Single Die And Stacked Dies Electronic Packaging. Masters thesis, Universiti Sains Malaysia.

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Abstract

Thermal analysis in single die and stacked dies electronic packaging for portable communication devices is very important due to lack of real estate for active cooling. Recent research had focused on active cooling and neglected the low cost passive cooling by optimizing the architecture of package structure and material selection. Stacked dies electronic package is an economical and good electrical performance innovation but inherent thermal problems which caused by thermal crosstalk. Recent methodology for numerical method and measurement method for thermal analysis in QFN and stacked dies LBGA is labor intensive, needs huge amount of investment and requires expert’s knowledge.

Item Type:	Thesis (Masters)
Subjects:	T Technology > TJ Mechanical engineering and machinery > TJ1-1570 Mechanical engineering and machinery
Divisions:	Kampus Kejuruteraan (Engineering Campus) > Pusat Pengajian Kejuruteraan Mekanikal (School of Mechanical Engineering) > Thesis
Depositing User:	ASM Ab Shukor Mustapa
Date Deposited:	18 Sep 2018 08:18
Last Modified:	12 Apr 2019 05:26
URI:	http://eprints.usm.my/id/eprint/41921

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