Lau, Chun Sean and Abdullah, M. Z. and Mujeebu, M. Abdul and Yusof, N. Md,
(2014)
Finite Element Analysis On The Effect Of Solder
Joint Geometry For The Reliability Of Ball Grid Array Assembly With Flexible And Rigid PCBS.
Journal of Engineering Science and Technology, 9 (1).
pp. 47-63.
ISSN 1823-4690
Abstract
In the present study, three-dimensional (3D) finite element simulation on 132
PIN fleXBGATM package was performed to predict the effect of solder joint
geometry on the reliability of Ball Grid Array (BGA) solder joints on flexible
and rigid PCBs subjected to thermo-cyclic loading. The commercial FEA tool
ABAQUS Version 6.9 was used for the simulations of various shapes of solder
joints such as barrel, column and hourglass. Apart from a global modeling, the
submodeling analysis technique (local modeling) was also used on the critically
affected solder joints, in order to enhance the computation efficiency. The
accumulated creep strain and strain energy density were observed for each case,
and optimum geometries were obtained. The model was validated with the
published experimental data with the minimum percentage error of 3%. It was
observed that the hourglass solder joint geometry was very crucial on the
reliability of BGA solder joints, and for a given PCB, the optimal choice of
hourglass solder joint geometry depended on its rigidity.
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