Effects of Solder Temperature on Pin Through-Hole during Wave Soldering: Thermal-Fluid Structure Interaction Analysis

Abdul Aziz, M. S. and Abdullah, M. Z. and Khor, C. Y. (2014) Effects of Solder Temperature on Pin Through-Hole during Wave Soldering: Thermal-Fluid Structure Interaction Analysis. Scientific World Journal, 2014 (482363). pp. 1-13. ISSN 2356-6140

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Abstract

An efficient simulation technique was proposed to examine the thermal-fluid structure interaction in the effects of solder temperature on pin through-hole during wave soldering. This study investigated the capillary flow behavior as well as the displacement, temperature distribution, and von Mises stress of a pin passed through a solder material. A single pin throughhole connector mounted on a printed circuit board (PCB) was simulated using a 3D model solved by FLUENT. The ABAQUS solver was employed to analyze the pin structure at solder temperatures of 456.15 K (183∘C) <

Item Type:	Article
Subjects:	T Technology > TJ Mechanical engineering and machinery > TJ1-1570 Mechanical engineering and machinery
Divisions:	Kampus Kejuruteraan (Engineering Campus) > Pusat Pengajian Kejuruteraan Mekanikal (School of Mechanical Engineering) > Article
Depositing User:	Mr Noorazilan Noordin
Date Deposited:	14 Feb 2018 04:14
Last Modified:	14 Feb 2018 04:14
URI:	http://eprints.usm.my/id/eprint/38922

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