Solder Joint Reliability Of Flip Chip BGA Package

Lee, Kor Oon (2004) Solder Joint Reliability Of Flip Chip BGA Package. Masters thesis, Universiti Sains Malaysia.

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Abstract

Daya tahan hubungan bebola pateri merupakan satu kriteria keboleharapan yang penting dalam pempakejan elektronik moden. The integrity of ball and bump solder joints is a major reliability concern in modern micro electronic packages.

Item Type: Thesis (Masters)
Subjects: T Technology > TA Engineering (General). Civil engineering (General) > TA1-2040 Engineering (General). Civil engineering (General)
Divisions: Kampus Kejuruteraan (Engineering Campus) > Pusat Pengajian Kejuruteraan Mekanikal (School of Mechanical Engineering) > Thesis
Depositing User: ARKM Al Rashid Automasi
Date Deposited: 14 Oct 2008 07:43
Last Modified: 17 Apr 2017 09:26
URI: http://eprints.usm.my/id/eprint/3572

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