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Silver Spot Plating Technique.

Siah, C.H. and Aziz, N. and Samad, Z and Idris , M. N. and Miskam, M.A. (2005) Silver Spot Plating Technique. In: Proceedings of the 4" Mechanical Engineering Research Colloquium (MERC 200511), 27-29 January 2005, School of Mechanical Engineering, USM, Penang, Malaysia.

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Abstract

Electroplating play an important roles in semiconductor manufacturing industries. A layer of silver or gold was selectively plated on the surface of lead frame by using electroplating technology. The purpose of depositing a layer of gold or silver on the surface of lead frame is to improve the bondability during die attach and wire bonding process.

Item Type:Conference or Workshop Item (Paper)
Subjects:T Technology > TP Chemical Technology > TP1-1185 Chemical technology
ID Code:9773
Deposited By:ARKM Al Rashid Automasi
Deposited On:07 May 2009 11:36
Last Modified:07 May 2009 11:36

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