Silver Spot Plating Technique.

Siah, C.H. and Aziz, N. and Samad, Z and Idris, M. N. and Miskam, M.A. (2005) Silver Spot Plating Technique. In: Proceedings of the 4" Mechanical Engineering Research Colloquium (MERC 200511), 27-29 January 2005, School of Mechanical Engineering, USM, Penang, Malaysia.

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    Abstract

    Electroplating play an important roles in semiconductor manufacturing industries. A layer of silver or gold was selectively plated on the surface of lead frame by using electroplating technology. The purpose of depositing a layer of gold or silver on the surface of lead frame is to improve the bondability during die attach and wire bonding process.

    Item Type: Conference or Workshop Item (Paper)
    Subjects: T Technology > TP Chemical Technology > TP1-1185 Chemical technology
    Divisions: Kampus Kejuruteraan (Engineering Campus) > Pusat Pengajian Kejuruteraan Kimia (School of Chemical Engineering)
    Depositing User: ARKM Al Rashid Automasi
    Date Deposited: 07 May 2009 11:36
    Last Modified: 13 Jul 2013 12:14
    URI: http://eprints.usm.my/id/eprint/9773

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