Heat Pipes In Electronic Packaging [TJ264. S774 2007 f rb].

Abstract

Industri electronik berkembang ke arah qualiti dan kelajuan computational yang tinggi. Keadaan ini menyebabkan peningkatan dalam flux haba. Sehubungan itu, para jurutera menghadapi satu cabaran baru untuk menangani masalah dalam pembungkusan chip. The electronic industry is developing towards higher quality and computational speed. It has led to the increase in chip heat fluxes. Therefore, the challenge has come for the engineers to overcome the problem in chip packaging.