Thermal Investigations Of Flip Chip Microelectronic Package With Non-Uniform Power Distribution [TK7874. G614 2004 f rb] [Microfiche 7607].

Abstract

Arah aliran pempakejan sistem-sistem dan subsistem mikroelektronik adalah kearah pengurangan saiz dan peningkatan prestasi, di mana kedua-duanya menyumbang kepada peningkatan kadar penjanaan haba. The trend in packaging microelectronic systems and subsystems has been to reduce size and increase performance, both of which contribute to increase heat generation.