Thermal Investigations Of Flip Chip Microelectronic Package With Non-Uniform Power Distribution [TK7874. G614 2004 f rb] [Microfiche 7607].

Goh, Teck Joo (2004) Thermal Investigations Of Flip Chip Microelectronic Package With Non-Uniform Power Distribution [TK7874. G614 2004 f rb] [Microfiche 7607]. PhD thesis, Universiti Sains Malaysia.

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Abstract

Arah aliran pempakejan sistem-sistem dan subsistem mikroelektronik adalah kearah pengurangan saiz dan peningkatan prestasi, di mana kedua-duanya menyumbang kepada peningkatan kadar penjanaan haba. The trend in packaging microelectronic systems and subsystems has been to reduce size and increase performance, both of which contribute to increase heat generation.

Item Type:	Thesis (PhD)
Subjects:	T Technology > TK Electrical Engineering. Electronics. Nuclear Engineering > TK7800-8360 Electronics
Divisions:	Kampus Kejuruteraan (Engineering Campus) > Pusat Pengajian Kejuruteraan Mekanikal (School of Mechanical Engineering)
Depositing User:	ARKM Al Rashid Automasi
Date Deposited:	06 Dec 2008 17:16
Last Modified:	13 Jul 2013 03:25
URI:	http://eprints.usm.my/id/eprint/6319

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