Gorji, Mohammad Saleh
(2014)
Fabrication And Characterization Of Embedded
Gold Nanoparticles In Metal Contacts For
Silicon And Silicon Carbide-Based Devices.
Masters thesis, Perpustakaan Hamzah Sendut.
Abstract
Embedding metal nanoparticles (NPs) into metal contacts, at the interface with
semiconductor, is an alternative method for modification of Schottky barrier height
(SBH) in electrical contacts and offers a tremendous simplification and adaptation in
processing steps. Schottky barrier diodes with aluminum (Al) contacts embedded
with gold (Au) NPs on n- and p-type silicon (Si) and silicon carbide (4H-SiC)
substrates were fabricated and their physical and electrical characteristics were
investigated. Based on the studies on Si surface contact angle measurement and the
negative zeta-potential values of seeded growth 20 nm Au NPs, an alternative
approach was proposed to deposit Au NPs on linker-free n- and p-Si substrates using
spin-coating technique. Density of NPs (determined by scanning electron
microscope) on n-Si was substantially higher than p-Si which was due to the
differences in surface properties of n- and p-Si. Current-voltage analysis of diodes
revealed an increase in current density in both bias directions due to NPs local
electric field enhancement effect and SBH lowering (0.1 1 eV for n- and 0.05 eV for
p-Si). The electrical results were then correlated to the structural properties of Al/Si
(determined by transmission electron microscope). Higher density of 5 and 10 nm Au
NPs were deposited on SiC surface by using acidification technique with diluted HF.
Al/4H-SiC diodes showed great improvement in SBH lowering (0.09 eV for n- and
0.24 eV for p-4H-SiC) and hence forward bias current density elevation while
maintaining the rectification properties in reverse bias.
Actions (login required)
 |
View Item |
