Abdul Aziz, M. S. and Abdullah, M. Z. and Khor, C. Y.
(2014)
Effects of Solder Temperature on Pin Through-Hole during
Wave Soldering: Thermal-Fluid Structure Interaction Analysis.
Scientific World Journal, 2014 (482363).
pp. 1-13.
ISSN 2356-6140
Abstract
An efficient simulation technique was proposed to examine the thermal-fluid structure interaction in the effects of solder
temperature on pin through-hole during wave soldering. This study investigated the capillary flow behavior as well as the
displacement, temperature distribution, and von Mises stress of a pin passed through a solder material. A single pin throughhole
connector mounted on a printed circuit board (PCB) was simulated using a 3D model solved by FLUENT. The ABAQUS
solver was employed to analyze the pin structure at solder temperatures of 456.15 K (183∘C) <
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