Lee, Kor Oon (2004) Solder Joint Reliability Of Flip Chip BGA Package. Masters thesis, Universiti Sains Malaysia.
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Abstract
Daya tahan hubungan bebola pateri merupakan satu kriteria keboleharapan yang penting dalam pempakejan elektronik moden. The integrity of ball and bump solder joints is a major reliability concern in modern micro electronic packages.
| Item Type: | Thesis (Masters) |
|---|---|
| Subjects: | T Technology > TA Engineering (General). Civil engineering (General) > TA1-2040 Engineering (General). Civil engineering (General) |
| Divisions: | Kampus Kejuruteraan (Engineering Campus) > Pusat Pengajian Kejuruteraan Mekanikal (School of Mechanical Engineering) > Thesis |
| Depositing User: | ARKM Al Rashid Automasi |
| Date Deposited: | 14 Oct 2008 07:43 |
| Last Modified: | 17 Apr 2017 09:26 |
| URI: | http://eprints.usm.my/id/eprint/3572 |
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