Heat Pipes In Electronic Packaging

Munusamy, Sri Jaiandran (2006) Heat Pipes In Electronic Packaging. Masters thesis, USM .

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Industri electronik berkembang ke arah qualiti dan kelajuan computational yang tinggi. The electronic industry is developing towards higher quality and computational speed. It has led to the increase in chip heat fluxes.

Item Type: Thesis (Masters)
Subjects: Q Science
Divisions: Pusat Pengajian Sains Fizik (School of Physics) > Thesis
Depositing User: Mr Firdaus Mohamad
Date Deposited: 24 Aug 2015 07:05
Last Modified: 22 Mar 2017 02:23
URI: http://eprints.usm.my/id/eprint/29322

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