Heat Pipes In Electronic Packaging

Munusamy, Sri Jaiandran (2006) Heat Pipes In Electronic Packaging. Masters thesis, USM .

[img]
Preview
PDF
Download (272Kb) | Preview

    Abstract

    Industri electronik berkembang ke arah qualiti dan kelajuan computational yang tinggi. The electronic industry is developing towards higher quality and computational speed. It has led to the increase in chip heat fluxes.

    Item Type: Thesis (Masters)
    Subjects: Q Science
    Divisions: Pusat Pengajian Sains Fizik (School of Physics) > Thesis
    Depositing User: Mr Firdaus Mohamad
    Date Deposited: 24 Aug 2015 15:05
    Last Modified: 22 Mar 2017 10:23
    URI: http://eprints.usm.my/id/eprint/29322

    Actions (login required)

    View Item
    Share