Munusamy, Sri Jaiandran (2006) Heat Pipes In Electronic Packaging. Masters thesis, USM .
|
PDF
Download (278kB) | Preview |
Abstract
Industri electronik berkembang ke arah qualiti dan kelajuan computational yang tinggi. The electronic industry is developing towards higher quality and computational speed. It has led to the increase in chip heat fluxes.
Item Type: | Thesis (Masters) |
---|---|
Subjects: | Q Science |
Divisions: | Pusat Pengajian Sains Fizik (School of Physics) > Thesis |
Depositing User: | Mr Firdaus Mohamad |
Date Deposited: | 24 Aug 2015 07:05 |
Last Modified: | 22 Mar 2017 02:23 |
URI: | http://eprints.usm.my/id/eprint/29322 |
Actions (login required)
View Item |