Computational Methods In Flip Chip Assembly.

Hj Abdul Azid, Assoc. Prof. Dr Ishak and Seetharamu, Prof. K.N. and Abdul Quadir, Assoc. Prof. Dr Ghulam (2002) Computational Methods In Flip Chip Assembly. Project Report. Universiti Sains Malaysia.

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    Abstract

    Flip chip technology, in the book edited by Lau (Lau, 1995) is defined as placing a chip to the substrate by flipping over the chip so that the I/O area of the chip is facing the substrate. By flipping over the chip, the interconnection between the chip and the substrate are achieved by conductive "bumps" placed directly in between the die surface and the substrate. Therefore, the whole chip surface can be utilized for active interconnections and at the same time, eliminates the need for wire bonding.

    Item Type: Monograph (Project Report)
    Subjects: T Technology > TJ Mechanical engineering and machinery > TJ1 Mechanical engineering and machinery
    Divisions: Kampus Kejuruteraan (Engineering Campus) > Pusat Pengajian Kejuruteraan Mekanikal (School of Mechanical Engineering)
    Depositing User: ARKM Al Rashid Automasi
    Date Deposited: 25 Jun 2009 08:42
    Last Modified: 13 Jul 2013 12:28
    URI: http://eprints.usm.my/id/eprint/10662

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