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Items where Author is "Lau, Chun Sean"
Group by: Item Type | No Grouping Number of items: 1. Lau, Chun Sean and Abdullah, M. Z. and Mujeebu, M. Abdul and Yusof, N. Md, (2014) Finite Element Analysis On The Effect Of Solder Joint Geometry For The Reliability Of Ball Grid Array Assembly With Flexible And Rigid PCBS. Journal of Engineering Science and Technology, 9 (1). pp. 47-63. ISSN 1823-4690 |
