Effect Of Lead-free Solder And Gold Content On The Shear Strength, Toughness, IMC And Void Formation [TT267. C518 2004 f rb Kejuruteraan] [Microfiche 7715].

Oo, Cheng Ee (2004) Effect Of Lead-free Solder And Gold Content On The Shear Strength, Toughness, IMC And Void Formation [TT267. C518 2004 f rb Kejuruteraan] [Microfiche 7715]. Masters thesis, Universiti Sains Malaysia.

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    Abstract

    Study of interaction between lead free solder with gold and the mechanical toughness,shear strength of solder that associated with intermetallic compound IMC and void formation was carried out. Kajian tentang interaksi antara logam pateri tanpa plumbum dengan emas dan keliatan,kekuatan ricih yang berkait rapat dengan pembentukan kompaun antaralogam dan lompong.

    Item Type: Thesis (Masters)
    Subjects: T Technology > TN Mining Engineering. Metallurgy > TN1-997 Mining engineering. Metallurgy
    Divisions: Kampus Kejuruteraan (Engineering Campus) > Pusat Pengajian Kejuruteraan Bahan & Sumber Mineral (School of Material & Mineral Resource Engineering)
    Depositing User: ARKM Al Rashid Automasi
    Date Deposited: 06 Dec 2008 09:07
    Last Modified: 13 Jul 2013 11:24
    URI: http://eprints.usm.my/id/eprint/6264

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