Adanan, Omar Mukhtar
(2013)
Impact Of Differential Pair Routing Discontinuities On Signal Integrity In Printed Circuit Board Design.
Masters thesis, Perpustakaan Hamzah Sendut.
Abstract
Differential pair routing on Printed Circuit Board (PCB) is widely used as
interconnect due to its excellent signal integrity performance, However, differential pair
is not immune to the impact of routing discontinuities. This research analyzed and
quantified the impact several types of routing discontinuities on differential pair. These
routing discontinuities are routing over split plane, routing over void, 45° bend routing
and serpentine routing. The results of this research are based on Full-wave 3D modeling
and simulation. The cross-sectional differential pair configuration parameters are based
on SATA 3rd Generation industrial standard. Four types of analysis have been done for
each of the routing discontinuities, which are S-parameter, TDR, Model Eye-Diagram
and Full Channel Transient Analysis. Based on configuration parameters used in this
research, the differential pair routing with routing discontinuities degrade the signal
integrity performance especially above 3GHz. Routing discontinuities also cause the
characteristic impedance of differential routing to change and lead to impedance
mismatch. Different types of routing discontinuities have different impact
characteristics. As for routing over split plane and void, the higher the number of split
planes or voids higher the degradation in signal integrity. As for serpentine and 45°
degree bend, inconsistence spacing within differential pair traces causes the signal
integrity performance to degrade.
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