Intermetallic Compound And Reliability Study Of Sac And Snbi Lead Free Solders

Wahab, Abdul Karim Abdul (2011) Intermetallic Compound And Reliability Study Of Sac And Snbi Lead Free Solders. Masters thesis, Universiti Sains Malaysia.

Preview

PDF Download (765kB) | Preview

Abstract

Due to the environmental concern for lead toxicity, the use of lead-free solder has been widespread in electronic packaging industries. In order for lead-free solder to replace the current lead solder, lead-free solder should have as close melting point as lead solder (1830C) and also has good wettability, excellent physical and mechanical properties. This thesis is devoted to the research and development of lead-free Sn-Bi and SAC based solder alloy for microelectronic packaging applications. A systematic study was conducted on the solders characteristics, wetting behavior, the interfacial reaction, mechanical properties and growth kinetics of solders on Cu and Ni-P substrate.

Item Type:	Thesis (Masters)
Subjects:	T Technology > TN Mining Engineering. Metallurgy > TN1-997 Mining engineering. Metallurgy
Divisions:	Kampus Kejuruteraan (Engineering Campus) > Pusat Pengajian Kejuruteraan Bahan & Sumber Mineral (School of Material & Mineral Resource Engineering) > Thesis
Depositing User:	ASM Ab Shukor Mustapa
Date Deposited:	01 Feb 2019 02:44
Last Modified:	12 Apr 2019 05:26
URI:	http://eprints.usm.my/id/eprint/43190

Actions (login required)

View Item