Interfacial Reactions And Electromigration In Lead-Free Solder Joints With Copper And Au-Ni Surface Finished Copper Substrates

Binh, Duong Ngoc (2009) Interfacial Reactions And Electromigration In Lead-Free Solder Joints With Copper And Au-Ni Surface Finished Copper Substrates. PhD thesis, Universiti Sains Malaysia.

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Abstract

Pencirian aloi pateri tanpa plumbum (Sn-9Zn, Sn-8Zn-3Bi dan Sn-3Ag-0.5Cu) ke atas substrat kumprum tanpa salutan dan yang disalut dengan Au-Ni telah dilakukan. Keputusan menunjukkan kebolehbasahan bagi ketiga-tiga aloi pateri ke atas substrat kuprum adalah baik pada suhu yang telah ditetapkan. Ukuran sudut sentuh dan daya basahan menunjukkan pembasahan yang baik telah tercapai. Properties of lead free solder alloys (Sn-9Zn, Sn-8Zn-3Bi and Sn-3Ag-0.5Cu) on Au-Ni surface finished copper and copper substrates were investigated. Results obtained showed good wetting of all three solder alloys on Au-Ni surface finished substrate at appropriate temperatures. Contact angle measurement and wetting force results reaffirmed that good wetting of solder alloys on substrate was achieved.

Item Type:	Thesis (PhD)
Subjects:	T Technology > TN Mining Engineering. Metallurgy > TN1-997 Mining engineering. Metallurgy
Divisions:	Kampus Kejuruteraan (Engineering Campus) > Pusat Pengajian Kejuruteraan Bahan & Sumber Mineral (School of Material & Mineral Resource Engineering) > Thesis
Depositing User:	Mr Mohammad Harish Sabri
Date Deposited:	24 Aug 2018 08:28
Last Modified:	12 Apr 2019 05:26
URI:	http://eprints.usm.my/id/eprint/41512

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