Electrical and Thermal Behavior of Copper-Epoxy Nanocomposites Prepared via Aqueous to Organic Phase Transfer Technique

Mohd Hirmizi, N. H. and Abu Bakar, M. and Tan, W. L. and Abu Bakar, N. H. H. and Ismail, J. and See, C. H. (2012) Electrical and Thermal Behavior of Copper-Epoxy Nanocomposites Prepared via Aqueous to Organic Phase Transfer Technique. Journal of Nanomaterials, 2012 (219073). pp. 1-11. ISSN 1687-4110

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    Abstract

    The preparation, electrical, and thermal behaviors of copper-epoxy nanocomposites are described. Cetyltrimethylammonium bromide- (CTAB-) stabilized copper (Cu) particles were synthesized via phase transfer technique. Isopropanol (IPA), sodium borohydride (NaBH4), and toluene solution of diglycidyl ether of bisphenol A (DGEBA) were used as transferring, reducing agent, and the organic phase, respectively. The UV-Vis absorbance spectra of all the sols prepared indicate that the presence of Cu particles with the particles transfer efficiency is ≥97%. The amount, size, and size distribution of particles in the organosol were dependent on the content of organic solute in the organosol. The composites were obtained upon drying the organosols and these were then subjected to further studies on the curing, thermal, and electrical characteristic. The presence of Cu fillers does not significantly affect the completeness of the composite curing process and only slightly reduce the thermal stability of the composites that is >300◦C. The highest conductivity value of the composites obtained is 3.06 × 10−2 S cm−1.

    Item Type: Article
    Subjects: Q Science > QD Chemistry > QD1-999 Chemistry
    Divisions: Kampus Kejuruteraan (Engineering Campus) > Pusat Pengajian Kejuruteraan Kimia (School of Chemical Engineering) > Article
    Depositing User: Mr Noorazilan Noordin
    Date Deposited: 14 Feb 2018 16:10
    Last Modified: 14 Feb 2018 16:10
    URI: http://eprints.usm.my/id/eprint/38942

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