Reverse engineering of B-pillar with 3D optical scanning for manufacturing of non-uniform thickness part

Islam, Md. Tasbirul and Abdullah, A.B. and Mahmud, Mohamad Zihad (2016) Reverse engineering of B-pillar with 3D optical scanning for manufacturing of non-uniform thickness part. MATEC Web of Conferences, 90 (01007). pp. 1-9.

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Abstract

This paper presents reverse engineering (RE) of a complex automobile structural part, B-pillar. As a major part of the automobile body-in white (BiW), B-pillar has substantial opportunity for weight reduction by introducing variable thickness across its sections. To leverage such potential, an existing B-pillar was reverse engineered with a 3D optical scanner and computer aided design (CAD) application. First, digital data (i.e. in meshes) of exiting B-pillar was obtained by the scanner, and subsequently, this information was utilized in developing a complete 3D CAD model. CATIA V5 was used in the modeling where some of the essential work benches were ‘’Digitized Shape Editor’’, ‘’Quick Surface Reconstruction’’, ‘’Wireframe and Surface Design’’, ‘’Freestyle’’, ‘’Generation Shape Design’’ and “Part design”. In the final CAD design, five different thicknesses were incorporated successfully in order to get a B-pillar with non-uniform sections. This research opened opportunities for thickness optimization and mold tooling design in real time manufacturing.

Item Type: Article
Subjects: T Technology > TJ Mechanical engineering and machinery > TJ1-1570 Mechanical engineering and machinery
T Technology > TL Motor vehicles. Aeronautics. Astronautics > TL500-777 Aeronautics. Aeronautical engineering
Divisions: Kampus Kejuruteraan (Engineering Campus) > Pusat Pengajian Kejuruteraan Aeroangkasa (School of Aerospace Engineering) > Article
Kampus Kejuruteraan (Engineering Campus) > Pusat Pengajian Kejuruteraan Mekanikal (School of Mechanical Engineering) > Article
Depositing User: Mr Noorazilan Noordin
Date Deposited: 17 Oct 2017 09:03
Last Modified: 17 Oct 2017 09:03
URI: http://eprints.usm.my/id/eprint/37195

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