Influence of Material Properties on the Fluid-Structure Interaction aspects during Molded Underfill Process

Khor, C.Y. and Ishak, Muhammad Ikman and Rosli, M.U. and Jamalludin, Mohd Riduan and Zakaria, M.S and Yamin, A.F.M. and Abdul Aziz, M.S. and Abdullah, M.Z. (2017) Influence of Material Properties on the Fluid-Structure Interaction aspects during Molded Underfill Process. MATEC Web of Conferences, 97 ( 01059). pp. 1-6. ISSN 2261-236X

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    Abstract

    This paper presents the investigation of the effects of epoxy moulding compound’ (EMC) viscosity on the FSI aspects during moulded underfill process (MUF). Finite volume (FV) code and finite element (FE) code were connected online through the Mesh-based Parallel Code Coupling Interface (MpCCI) method for fluid and structural analysis. The EMC flow behaviour was modelled by Castro-Macosko model, which was written in C language and incorporated into the FV analysis. Real-time predictions on the flow front, chip deformation and stress concentration were solved by FV- and FE-solver. Increase in EMC viscosity raises the deformation and stress imposed on IC and solder bump, which may induce unintended features on the IC structure. The current simulation is expected to provide the better understandings and clear visualization of FSI in the moulded underfill process.

    Item Type: Article
    Subjects: T Technology > TJ Mechanical engineering and machinery > TJ1-1570 Mechanical engineering and machinery
    T Technology > TL Motor vehicles. Aeronautics. Astronautics > TL1-4050 Motor vehicles. Aeronautics. Astronautics
    Divisions: Kampus Kejuruteraan (Engineering Campus) > Pusat Pengajian Kejuruteraan Aeroangkasa (School of Aerospace Engineering) > Article
    Kampus Kejuruteraan (Engineering Campus) > Pusat Pengajian Kejuruteraan Mekanikal (School of Mechanical Engineering) > Article
    Depositing User: Mr Noorazilan Noordin
    Date Deposited: 10 Oct 2017 12:17
    Last Modified: 10 Oct 2017 12:17
    URI: http://eprints.usm.my/id/eprint/37007

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