Tan , Kim Seah
(2015)
Investigations On Silver-Copper
Nanopaste As Die-Attach Material For
High Temperature Applications.
PhD thesis, Universiti Sains Malaysia.
Abstract
Satu nano-pes argentum-kuprum (Ag-Cu) yang dirumuskan dengan
mencampurkan nanopartikel Ag dan Cu dengan penambah organik (pelekat resin,
terpineol dan ethylene glycol) telah dihasilkan bagi diaplikasikan sebagai bahan
lampir-dai suhu tinggi. Pelbagai peratus berat nanopartikel Cu (20-80 wt%) telah
ditambahkan ke dalam nano-pes Ag-Cu, diikuti oleh pensinteran di udara terbuka
pada suhu 380°C selama 30 min tanpa bantuan tekanan luar, untuk mengkaji kesan
terhadap sifat-sifat fizikal, elektrikal, terma dan mekanikal.
A silver-copper (Ag-Cu) nanopaste formulated by mixing Ag and Cu
nanoparticles with organic additives (i.e., resin binder, terpineol and ethylene glycol)
which is meant for high-temperature die-attach applications has been developed.
Various weight percent of Cu nanoparticles (20-80 wt%) has been loaded into the
Ag-Cu nanopaste, followed by sintering in open air at temperature of 380°C for 30
min without the need of applied external pressure.
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