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Properties Of Epoxy/Silica Thin Film Composite For Electronic Application.

M, Mariatti and Foo, , Y.L. and A, Azizan and Sim, L.C. (2010) Properties Of Epoxy/Silica Thin Film Composite For Electronic Application. In: 7th Asian Australian Conference on Composite Materials”, 15-18 November 2010 , Taipei,Taiwan .

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Abstract

In line with the miniaturization trends of the product designs in electronic industry, conventional packaging technology has been replaced.

Item Type:Conference or Workshop Item (Paper)
Subjects:T Technology > TN Mining Engineering. Metallurgy > TN1-997 Mining engineering. Metallurgy
ID Code:20364
Deposited By:Mr Erwan Roslan
Deposited On:27 Dec 2010 09:35
Last Modified:27 Dec 2010 09:35

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