Properties Of Epoxy/Silica Thin Film Composite For Electronic Application.

M, Mariatti and Foo,, Y.L. and A, Azizan and Sim, L.C. (2010) Properties Of Epoxy/Silica Thin Film Composite For Electronic Application. In: 7th Asian Australian Conference on Composite Materials”, 15-18 November 2010 , Taipei,Taiwan .

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    Abstract

    In line with the miniaturization trends of the product designs in electronic industry, conventional packaging technology has been replaced.

    Item Type: Conference or Workshop Item (Paper)
    Subjects: T Technology > TN Mining Engineering. Metallurgy > TN1-997 Mining engineering. Metallurgy
    Divisions: Kampus Kejuruteraan (Engineering Campus) > Pusat Pengajian Kejuruteraan Bahan & Sumber Mineral (School of Material & Mineral Resource Engineering)
    Depositing User: Mr Erwan Roslan
    Date Deposited: 27 Dec 2010 09:35
    Last Modified: 13 Jul 2013 15:48
    URI: http://eprints.usm.my/id/eprint/20364

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