M, Mariatti and Foo,, Y.L. and A, Azizan and Sim, L.C. (2010) Properties Of Epoxy/Silica Thin Film Composite For Electronic Application. In: 7th Asian Australian Conference on Composite Materials”, 15-18 November 2010 , Taipei,Taiwan .
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Abstract
In line with the miniaturization trends of the product designs in electronic industry, conventional packaging technology has been replaced.
| Item Type: | Conference or Workshop Item (Paper) |
|---|---|
| Subjects: | T Technology > TN Mining Engineering. Metallurgy > TN1-997 Mining engineering. Metallurgy |
| Divisions: | Kampus Kejuruteraan (Engineering Campus) > Pusat Pengajian Kejuruteraan Bahan & Sumber Mineral (School of Material & Mineral Resource Engineering) |
| Depositing User: | Mr Erwan Roslan |
| Date Deposited: | 27 Dec 2010 01:35 |
| Last Modified: | 13 Jul 2013 07:48 |
| URI: | http://eprints.usm.my/id/eprint/20364 |
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