Samad, Rosdiyana and Arshad, Mohd Rizal and Samad, Zahurin (2005) Design Of Crack Detection System Software For IC Package Using Blob Analysis And Neural Network. In: Proceedings of the 9th WSEAS International CSCC Multiconference : Circuits ’05, System ’05, Computer ’05, Communication ‘05, , 11-16 July 2005 , Vouliagmeni, Athens, Greece.
In this research, three methods for the detection of crack defects on integrated circuit (IC) packages are proposed. These methods use blob analysis technique in image processing stage, and use multi-layered perceptron (MLP) neural network to classify the IC package.
Actions (login required)