Design Of Crack Detection System Software For IC Package Using Blob Analysis And Neural Network.

Samad, Rosdiyana and Arshad, Mohd Rizal and Samad, Zahurin (2005) Design Of Crack Detection System Software For IC Package Using Blob Analysis And Neural Network. In: Proceedings of the 9th WSEAS International CSCC Multiconference : Circuits ’05, System ’05, Computer ’05, Communication ‘05, , 11-16 July 2005 , Vouliagmeni, Athens, Greece.

Preview

PDF Download (321kB) | Preview

Abstract

In this research, three methods for the detection of crack defects on integrated circuit (IC) packages are proposed. These methods use blob analysis technique in image processing stage, and use multi-layered perceptron (MLP) neural network to classify the IC package.

Item Type:	Conference or Workshop Item (Paper)
Subjects:	T Technology > TK Electrical Engineering. Electronics. Nuclear Engineering > TK1-9971 Electrical engineering. Electronics. Nuclear engineering
Divisions:	Kampus Kejuruteraan (Engineering Campus) > Pusat Pengajian Kejuruteraaan Elektrik & Elektronik (School of Electrical & Electronic Engineering) > Conference or Workshop Item
Depositing User:	Mr Erwan Roslan
Date Deposited:	10 Nov 2009 01:52
Last Modified:	20 Nov 2017 07:22
URI:	http://eprints.usm.my/id/eprint/14359

Actions (login required)

View Item