Hj Abdul Azid, Ishak and Seetharamu, K.N. and Abdul Quadir, Ghulam (2002) Computational methods in Flipchip assembly. Project Report. Universiti Sains Malaysia.
Full text not available from this repository.Abstract
Flip chip technology, in the book edited by Lau (Lau, 1995) is defined as placing a chip to the substrate by flipping over the chip so that the I/O area of the chip is facing the substrate. By flipping over the chip, the interconnection between the chip and the substrate are achieved by conductive "bumps" placed directly in between the die surface and the substrate. Therefore, the whole chip surface can be utilized for active interconnections and at the same time, eliminates the need for wire bonding.
| Item Type: | Monograph (Project Report) |
|---|---|
| Subjects: | T Technology > TJ Mechanical engineering and machinery > TJ1-1570 Mechanical engineering and machinery |
| Divisions: | Kampus Kejuruteraan (Engineering Campus) > Pusat Pengajian Kejuruteraan Mekanikal (School of Mechanical Engineering) |
| Depositing User: | Mr Erwan Roslan |
| Date Deposited: | 22 Jun 2009 00:24 |
| Last Modified: | 12 Sep 2017 07:11 |
| URI: | http://eprints.usm.my/id/eprint/10584 |
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