The Influence Of Gallium Addition On The Properties Of Sn3.0Ag0.5Cu Lead Free Solder [TD799.85. F146 2008 f rb].

Zakaria, Mohamad Fadley (2008) The Influence Of Gallium Addition On The Properties Of Sn3.0Ag0.5Cu Lead Free Solder [TD799.85. F146 2008 f rb]. Masters thesis, Universiti Sains Malaysia.

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Abstract

Kajian ini menekankan ke atas kesan penambahan gallium (Ga) ke atas sifatsifat fizikal, mekanikal dan metalurgi bagi pateri bebas plumbum Sn3.0Ag0.5Cu (berdasarkan peratus berat). The work focused on the effect of Gallium (Ga) additions on the physical, mechanical and metallurgical properties of Sn3.0Ag0.5Cu lead free solder (by the weight percentage).

Item Type: Thesis (Masters)
Subjects: T Technology > TD Environmental technology. Sanitary engineering > TD783-812.5 Municipal refuse. Solid wastes
Divisions: Kampus Kejuruteraan (Engineering Campus) > Pusat Pengajian Kejuruteraan Bahan & Sumber Mineral (School of Material & Mineral Resource Engineering) > Thesis
Depositing User: Mr Erwan Roslan
Date Deposited: 04 Jun 2009 00:49
Last Modified: 15 May 2017 08:05
URI: http://eprints.usm.my/id/eprint/10393

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