Siah, C.H. and Aziz, N. and Samad, Z and Idris, M. N. and Miskam, M.A. Review Of Selective Plating Process For Lead Frame Manufacturing. Working Paper. Universiti Sains Malaysia.
Electroplating play an important roles in semiconductor manufacturing industries. A layer of silver or gold was selectively plated on the surface of lead frame by using electroplating technology. The purpose of depositing a layer of gold or silver on the surface of lead frame is to improve the bondability during die attach and wire bonding process.
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