Review Of Selective Plating Process For Lead Frame Manufacturing.

Siah, C.H. and Aziz, N. and Samad, Z and Idris, M. N. and Miskam, M.A. Review Of Selective Plating Process For Lead Frame Manufacturing. Working Paper. Universiti Sains Malaysia.

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    Abstract

    Electroplating play an important roles in semiconductor manufacturing industries. A layer of silver or gold was selectively plated on the surface of lead frame by using electroplating technology. The purpose of depositing a layer of gold or silver on the surface of lead frame is to improve the bondability during die attach and wire bonding process.

    Item Type: Monograph (Working Paper)
    Subjects: T Technology > TP Chemical Technology > TP1-1185 Chemical technology
    Divisions: Kampus Kejuruteraan (Engineering Campus) > Pusat Pengajian Kejuruteraan Kimia (School of Chemical Engineering)
    Depositing User: ARKM Al Rashid Automasi
    Date Deposited: 05 May 2009 11:41
    Last Modified: 13 Jul 2013 12:13
    URI: http://eprints.usm.my/id/eprint/9728

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