Login | Create Account
   

Review Of Selective Plating Process For Lead Frame Manufacturing.

Siah, C.H. and Aziz , N. and Samad, Z and Idris , M. N. and Miskam, M.A. Review Of Selective Plating Process For Lead Frame Manufacturing. Working Paper. Universiti Sains Malaysia.

[img]
Preview
PDF - Requires a PDF viewer such as GSview, Xpdf or Adobe Acrobat Reader
4Mb

Abstract

Electroplating play an important roles in semiconductor manufacturing industries. A layer of silver or gold was selectively plated on the surface of lead frame by using electroplating technology. The purpose of depositing a layer of gold or silver on the surface of lead frame is to improve the bondability during die attach and wire bonding process.

Item Type:Monograph (Working Paper)
Subjects:T Technology > TP Chemical Technology > TP1-1185 Chemical technology
ID Code:9728
Deposited By:ARKM Al Rashid Automasi
Deposited On:05 May 2009 11:41
Last Modified:05 May 2009 11:41

Repository Staff Only: item control page

USM is powered by EPrints 3 which is developed by the School of Electronics and Computer Science at the University of Southampton. More information and software credits.
Share