A Review Of The Fundamentatls Studies For The Electroplating Process

Siah, C.H. and Aziz, N and Samad, Z and Idris, M.N. and Miskam, M.A. (2002) A Review Of The Fundamentatls Studies For The Electroplating Process. Project Report. Universiti Sains Malaysia.

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    Abstract

    In semiconductor industries, electroplating process have been widely used to manufacture integrated circuit.(IC).

    Item Type: Monograph (Project Report)
    Subjects: T Technology > TA Engineering (General). Civil engineering (General) > TA1-2040 Engineering (General). Civil engineering (General)
    Divisions: Kampus Kejuruteraan (Engineering Campus) > Pusat Pengajian Kejuruteraan Kimia (School of Chemical Engineering)
    Depositing User: ARKM Al Rashid Automasi
    Date Deposited: 22 Dec 2008 15:02
    Last Modified: 13 Jul 2013 11:31
    URI: http://eprints.usm.my/id/eprint/6835

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