Feasibility Study Of Exploring Ultrasonic Flexural Wave As A Cooling Mechnism In Microelectronic Systems.

Almanar, Prof.Madya Indra Putra and Mohd Ripin, Prof.Madya Zaidi and Abdullah, Prof.Madya M.Z. (2006) Feasibility Study Of Exploring Ultrasonic Flexural Wave As A Cooling Mechnism In Microelectronic Systems. Project Report. Universiti Sains Malaysia.

[img]
Preview
PDF
Download (1502Kb) | Preview

    Abstract

    Static, model and harmonic analysis of bimetallic beam called bimorph has been performed using commercial Finite Element Analysis software package,ANSYS.

    Item Type: Monograph (Project Report)
    Subjects: T Technology > TJ Mechanical engineering and machinery > TJ1 Mechanical engineering and machinery
    Divisions: Kampus Kejuruteraan (Engineering Campus) > Pusat Pengajian Kejuruteraan Mekanikal (School of Mechanical Engineering)
    Depositing User: ARKM Al Rashid Automasi
    Date Deposited: 10 Dec 2008 13:23
    Last Modified: 13 Jul 2013 11:25
    URI: http://eprints.usm.my/id/eprint/6364

    Actions (login required)

    View Item
    Share