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Feasibility Study Of Exploring Ultrasonic Flexural Wave As A Cooling Mechnism In Microelectronic Systems.

Almanar, Prof.Madya Indra Putra and Mohd Ripin, Prof.Madya Zaidi and Abdullah, Prof.Madya M.Z. (2006) Feasibility Study Of Exploring Ultrasonic Flexural Wave As A Cooling Mechnism In Microelectronic Systems. Project Report. Universiti Sains Malaysia.

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Abstract

Static, model and harmonic analysis of bimetallic beam called bimorph has been performed using commercial Finite Element Analysis software package,ANSYS.

Item Type:Monograph (Project Report)
Subjects:T Technology > TJ Mechanical engineering and machinery > TJ1 Mechanical engineering and machinery
ID Code:6364
Deposited By:ARKM Al Rashid Automasi
Deposited On:10 Dec 2008 13:23
Last Modified:12 Dec 2008 18:14

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