Mold Flow FEA Simulation Software Development.

Hj Abdul Azid, Assoc. Prof. Dr Ishak and Seetharamu, Prof. K.N. and Abdul Quadir, Assoc. Prof. Dr Ghulam (2005) Mold Flow FEA Simulation Software Development. Project Report. Universiti Sains Malaysia.

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    Abstract

    The present trend in electronics industry is towards the miniaturization of product designs. Basic concept is to make the products lighter, smaller, less expensive and at the same time to be faster, more powerful, reliable, user-friendly, more attractive (aesthetics look) with added functional features. Few examples of today's "shrinking" products include cellular phones,pagers, personal digital assistants(PDAs), laptops, personal notebook computers, camcorders, palmtop organizers, telecommunications equipments and automotive microelectronic components.

    Item Type: Monograph (Project Report)
    Subjects: T Technology > TJ Mechanical engineering and machinery > TJ1 Mechanical engineering and machinery
    Divisions: Kampus Kejuruteraan (Engineering Campus) > Pusat Pengajian Kejuruteraan Mekanikal (School of Mechanical Engineering)
    Depositing User: ARKM Al Rashid Automasi
    Date Deposited: 25 Jun 2009 09:51
    Last Modified: 13 Jul 2013 12:28
    URI: http://eprints.usm.my/id/eprint/10666

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