Login | Create Account
   

Mold Flow FEA Simulation Software Development.

Hj Abdul Azid, Assoc. Prof. Dr Ishak and Seetharamu, Prof. K.N. and Abdul Quadir, Assoc. Prof. Dr Ghulam (2005) Mold Flow FEA Simulation Software Development. Project Report. Universiti Sains Malaysia.

[img]
Preview
PDF - Requires a PDF viewer such as GSview, Xpdf or Adobe Acrobat Reader
4Mb

Abstract

The present trend in electronics industry is towards the miniaturization of product designs. Basic concept is to make the products lighter, smaller, less expensive and at the same time to be faster, more powerful, reliable, user-friendly, more attractive (aesthetics look) with added functional features. Few examples of today's "shrinking" products include cellular phones,pagers, personal digital assistants(PDAs), laptops, personal notebook computers, camcorders, palmtop organizers, telecommunications equipments and automotive microelectronic components.

Item Type:Monograph (Project Report)
Subjects:T Technology > TJ Mechanical engineering and machinery > TJ1 Mechanical engineering and machinery
ID Code:10666
Deposited By:ARKM Al Rashid Automasi
Deposited On:25 Jun 2009 09:51
Last Modified:25 Jun 2009 09:51

Repository Staff Only: item control page

Share