Mold Flow FEA Simulation Software Development

Hj Abdul Azid, Assoc. Prof. Dr Ishak and Seetharamu, Prof. K.N. and Abdul Quadir, Assoc. Prof. Dr Ghulam (2005) Mold Flow FEA Simulation Software Development. Project Report. Universiti Sains Malaysia.

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    Abstract

    The present trend in electronics industry is towards the miniaturization of product designs. Basic concept is to make the products lighter, smaller, less expensive and at the same time to be faster, more powerful, reliable, user-friendly, more attractive (aesthetics look) with added functional features.

    Item Type: Monograph (Project Report)
    Subjects: T Technology > TJ Mechanical engineering and machinery > TJ1-1570 Mechanical engineering and machinery
    Divisions: Kampus Kejuruteraan (Engineering Campus) > Pusat Pengajian Kejuruteraan Mekanikal (School of Mechanical Engineering)
    Depositing User: Mr Erwan Roslan
    Date Deposited: 23 Jun 2009 14:21
    Last Modified: 13 Jul 2013 12:27
    URI: http://eprints.usm.my/id/eprint/10611

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