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Low Ete Substrate To Improve Warpage And Solder Joint Realibility.

Jaafar @ Mustapha, Dr. Mariatti (2008) Low Ete Substrate To Improve Warpage And Solder Joint Realibility. Project Report. Universiti Sains Malaysia.

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Abstract

In electronic packaging industry organic substrate materials have been introduced- in market to meet the trends of low cost, high interconnect and better reliability.

Item Type:Monograph (Project Report)
Subjects:T Technology > TN Mining Engineering. Metallurgy > TN1-997 Mining engineering. Metallurgy
ID Code:10481
Deposited By:Mr Erwan Roslan
Deposited On:09 Jun 2009 13:45
Last Modified:09 Jun 2009 13:45

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