Low Ete Substrate To Improve Warpage And Solder Joint Realibility.

Jaafar @ Mustapha, Dr. Mariatti (2008) Low Ete Substrate To Improve Warpage And Solder Joint Realibility. Project Report. Universiti Sains Malaysia.

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    Abstract

    In electronic packaging industry organic substrate materials have been introduced- in market to meet the trends of low cost, high interconnect and better reliability.

    Item Type: Monograph (Project Report)
    Subjects: T Technology > TN Mining Engineering. Metallurgy > TN1-997 Mining engineering. Metallurgy
    Divisions: Kampus Kejuruteraan (Engineering Campus) > Pusat Pengajian Kejuruteraan Bahan & Sumber Mineral (School of Material & Mineral Resource Engineering)
    Depositing User: Mr Erwan Roslan
    Date Deposited: 09 Jun 2009 13:45
    Last Modified: 13 Jul 2013 12:25
    URI: http://eprints.usm.my/id/eprint/10481

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