Login | Create Account
   

Conductive Polymer Composite For Electronic Packaging.

Jaafar @ Mustapha , Dr. Mariatti (2008) Conductive Polymer Composite For Electronic Packaging. Project Report. Universiti Sains Malaysia.

[img]
Preview
PDF - Requires a PDF viewer such as GSview, Xpdf or Adobe Acrobat Reader
1883Kb

Abstract

Soldering technology using tin/lead (Sn/Pb) solders plays an important role in electronic packaging, such as flip-chip, solder-ball connections in ball grid arrays (BGA), and integrated circuit (IC) package assembly to a printed circuit board (PCB) (Kang et at., 1998; Lu and Wong, 2000c; Li and Wong, 2004b). With advances in microelectronics, some issues associated with Sn/Pb solders have become noticeable.

Item Type:Monograph (Project Report)
Subjects:T Technology > TN Mining Engineering. Metallurgy > TN1-997 Mining engineering. Metallurgy
ID Code:10057
Deposited By:ARKM Al Rashid Automasi
Deposited On:15 May 2009 08:25
Last Modified:15 May 2009 08:25

Repository Staff Only: item control page

USM is powered by EPrints 3 which is developed by the School of Electronics and Computer Science at the University of Southampton. More information and software credits.
Share