Conductive Polymer Composite For Electronic Packaging.

Jaafar @ Mustapha, Dr. Mariatti (2008) Conductive Polymer Composite For Electronic Packaging. Project Report. Universiti Sains Malaysia.

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    Abstract

    Soldering technology using tin/lead (Sn/Pb) solders plays an important role in electronic packaging, such as flip-chip, solder-ball connections in ball grid arrays (BGA), and integrated circuit (IC) package assembly to a printed circuit board (PCB) (Kang et at., 1998; Lu and Wong, 2000c; Li and Wong, 2004b). With advances in microelectronics, some issues associated with Sn/Pb solders have become noticeable.

    Item Type: Monograph (Project Report)
    Subjects: T Technology > TN Mining Engineering. Metallurgy > TN1-997 Mining engineering. Metallurgy
    Divisions: Kampus Kejuruteraan (Engineering Campus) > Pusat Pengajian Kejuruteraan Bahan & Sumber Mineral (School of Material & Mineral Resource Engineering)
    Depositing User: ARKM Al Rashid Automasi
    Date Deposited: 15 May 2009 08:25
    Last Modified: 13 Jul 2013 12:18
    URI: http://eprints.usm.my/id/eprint/10057

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