Jaafar @ Mustapha, Dr. Mariatti (2008) Conductive Polymer Composite For Electronic Packaging. Project Report. Universiti Sains Malaysia.
Soldering technology using tin/lead (Sn/Pb) solders plays an important role in electronic packaging, such as flip-chip, solder-ball connections in ball grid arrays (BGA), and integrated circuit (IC) package assembly to a printed circuit board (PCB) (Kang et at., 1998; Lu and Wong, 2000c; Li and Wong, 2004b). With advances in microelectronics, some issues associated with Sn/Pb solders have become noticeable.
Actions (login required)